RM2 to show-off smart packing solutions with AT&T

Pallet development, management and supply company RM2 International announced on Friday it will participate in AT&T's LTE-M network pilot that promises to boost connections for the so-called ‘Internet of Things’ (IoT).

The AIM-traded firm said it will introduce the RM2ELIoT product at the Pack Expo International and Pharma Expo on 8 November.

It said AT&T is working with a variety of technology leaders, including RM2, to showcase the new LTE-M technology that will bring the IoT to a new generation of devices and markets.

The American telco has launched North America's first LTE-M enabled commercial site in the San Francisco market to support the pilot of its Low-Power Wide-Area network beginning later in the month.

It reportedly plans to make the technology available across its commercial network throughout 2017.

RM2 said it has developed RM2ELIoT, which is a fully integrated, zero maintenance, long-life IoT-based track and trace solution that promises to transform the reusable packaging industry.

It said AT&T's LTE-M network can support the solution through enabling up to 10 years of battery life and better wireless coverage deep inside buildings and in subterranean environments.

“Our work with RM2 during our LTE-M pilot will show how this new technology can help the packaging and supply chain industries increase their efficiency and sustain the integrity of their products," said Chris Penrose, president of Internet of Things solutions at AT&T.

“This a prime example of how innovations like LTE-M will help bring the IoT to more endpoints than ever before.”

John Walsh, CEO of RM2 added: "Delivering to the market a first of its kind technology solution while being a part of a group that will take this offering to the next level gives RM2 a unique product offering that separates itself from other pallet service providers while guaranteeing its solution remains at the forefront of the technological evolution of the Internet of Things.”