Aim Bulletin
22 Dec
EnSilica strikes high-end ASIC development and supply agreement
Chip maker EnSilica said on Friday that it has entered into an exclusive and binding Letter of intent for the development and supply of high-end application-specific integrated circuits for use in telecommunications infrastructure.
22 Dec
Bidstack settles legal dispute with Azerion, agrees to new commercial partnership
Software firm Bidstack shares surged on Friday after settling its legal dispute with partner Azerion and agreeing to a new commercial partnership.